Evaluation of the modified edge lift-off test for adhesion...

Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications

Hay, Jack C., Liniger, Eric G., Liu, Xiao Hu
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Volume:
16
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2001.0058
Date:
February, 2001
File:
PDF, 199 KB
english, 2001
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