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Crack-Less Wafer-Level Packaging Using Flash Heating Technique for Micro Devices
Namazu, Takahiro, Ohtani, Kohei, Yoshiki, Keisuke, Inoue, ShozoVolume:
706-709
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.706-709.1979
Date:
January, 2012
File:
PDF, 1.26 MB
english, 2012