Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding

MRS Proceedings 2005 / 1 Vol. 863

Mechanisms of Low-Temperature Ti/Si-Based Wafer Bonding

Yu, Jian, Wang, Yinmin, Haberl, Arthur W., Bakhru, Hassa, Lu, Jian-Qiang, Gutmann, Ronald J.
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Volume:
863
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-863-B10.7
Date:
January, 2005
File:
PDF, 368 KB
english, 2005
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