Prediction of Electromigration Induced Void and Hillock for...

Prediction of Electromigration Induced Void and Hillock for IC Interconnect Structures

Zhang, Yuan Xiang, Wu, Jun, Ji, Ying Yu
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Volume:
546
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.546.6
Date:
March, 2013
File:
PDF, 708 KB
english, 2013
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