Sealing of adhesive bonded devices on wafer level

Sensors and Actuators A: Physical 2004 Vol. 110; Iss. 1-3

Sealing of adhesive bonded devices on wafer level

J. Oberhammer, F. Niklaus, G. Stemme
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Volume:
110
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.sna.2003.06.003
File:
PDF, 255 KB
english, 2004
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