Steady-state measurement of wafer bonding cracking...

Sensors and Actuators A: Physical 2004 Vol. 110; Iss. 1-3

Steady-state measurement of wafer bonding cracking resistance

Y. Bertholet, F. Iker, J.P. Raskin, T. Pardoen
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Volume:
110
Year:
2004
Language:
english
Pages:
7
DOI:
10.1016/j.sna.2003.09.004
File:
PDF, 173 KB
english, 2004
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