Flexible polysilicon sensor array modules using...

Sensors and Actuators A: Physical 2004 Vol. 111; Iss. 1

Flexible polysilicon sensor array modules using “etch-release” packaging scheme

Eun-Soo Hwang, Yong-Jun Kim, Byeong-Kwon Ju
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Volume:
111
Year:
2004
Language:
english
Pages:
7
DOI:
10.1016/j.sna.2003.10.022
File:
PDF, 273 KB
english, 2004
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