Residual stresses in a pressure-sensor package induced by...

Sensors and Actuators A: Physical 2004 Vol. 116; Iss. 3

Residual stresses in a pressure-sensor package induced by adhesive material during curing: a case study

Marina Santo Zarnik, Dubravka Rocak, Sreco Macek
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Volume:
116
Year:
2004
Language:
english
Pages:
8
DOI:
10.1016/j.sna.2004.05.010
File:
PDF, 272 KB
english, 2004
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