Bottom-Up Filling Using Electrochemical Oxidation on Patterned Wafers
Cha, Seung Hwan, Kim, Seung-Soo, Cho, Sung Ki, Kim, Jae JeongVolume:
8
Year:
2005
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.2063248
File:
PDF, 278 KB
english, 2005