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Bonding characteristics of 3C-SiC wafers with hydrofluoric acid for high-temperature MEMS applications
Gwiy-Sang Chung, Roya MaboudianVolume:
119
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.sna.2004.10.004
File:
PDF, 358 KB
english, 2005