Novel room-temperature first-level packaging process for...

Sensors and Actuators A: Physical 2005 Vol. 123-124; Iss. none

Novel room-temperature first-level packaging process for microscale devices

Wen-Yue Zhang, Joseph P. Labukas, Svetlana Tatic-Lucic, Lyndon Larson, Thirumalesh Bannuru, Richard P. Vinci, Gregory S. Ferguson
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Volume:
123-124
Year:
2005
Language:
english
Pages:
9
DOI:
10.1016/j.sna.2005.03.008
File:
PDF, 565 KB
english, 2005
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