Packaging effect investigation of CMOS compatible pressure...

Sensors and Actuators A: Physical 2006 Vol. 126; Iss. 1

Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies

Chang-Chun Lee, Chih-Tang Peng, Kuo-Ning Chiang
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Volume:
126
Year:
2006
Language:
english
Pages:
8
DOI:
10.1016/j.sna.2005.09.018
File:
PDF, 831 KB
english, 2006
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