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[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Weakening of Hardness and Modulus of the Si Lattice by Hydrogen Implantation for Layer Transfer in Wafer Bonding Technology
Gu, Diefeng, Baumgart, H., Bourdelle, Konstantin, Celler, George K., Elmustafa, AbdelmageedVolume:
16
Year:
2008
Language:
english
DOI:
10.1149/1.2982891
File:
PDF, 1.69 MB
english, 2008