Thermal Stresses in SiC-Si3N4 Cubic-Cell-Divided...

Thermal Stresses in SiC-Si3N4 Cubic-Cell-Divided Multi-Particle-Matrix System

Ceniga, L.
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Volume:
290
Year:
2005
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.290.320
File:
PDF, 240 KB
english, 2005
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