Integration of trench-isolated through-wafer interconnects with 2d capacitive micromachined ultrasonic transducer arrays
Xuefeng Zhuang, Arif S. Ergun, Yongli Huang, Ira O. Wygant, Omer Oralkan, Butrus T. Khuri-YakubVolume:
138
Year:
2007
Language:
english
Pages:
9
DOI:
10.1016/j.sna.2007.04.008
File:
PDF, 1.73 MB
english, 2007