Three-dimensional integration scheme with a thermal budget...

Sensors and Actuators A: Physical 2007 Vol. 139; Iss. 1-2

Three-dimensional integration scheme with a thermal budget below 300 °C

P. Benkart, A. Munding, A. Kaiser, E. Kohn, A. Heittmann, H. Huebner, U. Ramacher
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Volume:
139
Year:
2007
Language:
english
Pages:
6
DOI:
10.1016/j.sna.2007.04.032
File:
PDF, 928 KB
english, 2007
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