Sensitivity analysis of packaging effect of silicon-based...

Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor

Tsung-Lin Chou, Chen-Hung Chu, Chun-Te Lin, Kuo-Ning Chiang
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Volume:
152
Year:
2009
Language:
english
Pages:
10
DOI:
10.1016/j.sna.2009.03.007
File:
PDF, 2.48 MB
english, 2009
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