Void control in adhesive bonding using thermosetting...

Sensors and Actuators A: Physical 2011 Vol. 167; Iss. 2

Void control in adhesive bonding using thermosetting polymer

Lei Nie, Kiwon Lee, Sangyong Lee, Tielin Shi, Guanglan Liao
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Volume:
167
Year:
2011
Language:
english
Pages:
8
DOI:
10.1016/j.sna.2011.03.028
File:
PDF, 1.26 MB
english, 2011
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