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Thermal Analysis of a Hot Runner System in Injection Mold
Hu, Qing Chun, Wang, Li Ming, Tang, Ming Zhen, Wang, Yong ShengVolume:
346
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.346.564
Date:
September, 2011
File:
PDF, 455 KB
english, 2011