Epoxy resins as stamps for hot embossing of microstructures...

Sensors and Actuators B: Chemical 2005 Vol. 107; Iss. 2

Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels

Terry Koerner, Laurie Brown, Ruixi Xie, Richard D. Oleschuk
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Volume:
107
Year:
2005
Language:
english
Pages:
8
DOI:
10.1016/j.snb.2004.11.035
File:
PDF, 353 KB
english, 2005
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