Numerical Analysis of Residual Warpage of FBGA Package...

Numerical Analysis of Residual Warpage of FBGA Package during EMC Curing Process

Park, Yong Tae, Kang, Tae Min
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Volume:
334-335
Year:
2007
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.334-335.385
File:
PDF, 784 KB
english, 2007
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