Thermal Analysis of High-Power Multichip COB Light-Emitting Diodes With Different Chip Sizes
Ying, Shang-Ping, Shen, Wei-BoVolume:
62
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/ted.2015.2390255
Date:
March, 2015
File:
PDF, 1.64 MB
english, 2015