The Application of the Solute Sweeping Model for Grain Boundary Liquation during Welding and Sub-Solidus Annealing of an Al-Cu Alloy
Wilson, Andre L., Martukanitz, Richard P., Howell, Paul R.Volume:
331-337
Year:
2000
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.331-337.1113
File:
PDF, 623 KB
2000