Influence of Surface Finish of Cu Electrode on Shear Strength and Microstructure of Solder Joint with Sn-3Ag-0.5Cu
Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, ToshikazuVolume:
297-300
Year:
2005
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.297-300.2864
File:
PDF, 454 KB
english, 2005