Adhesion and Cu Diffusion Barrier Properties of a MnOx...

MRS Proceedings 2009 / 1 Vol. 1156

Adhesion and Cu Diffusion Barrier Properties of a MnOx Barrier Layer Formed with Thermal MOCVD

Neishi, Koji, Dixit, Vijay Kumar, Aki, S., Koike, Junichi, Matsumoto, K., Sato, H., Itoh, H., Hosaka, S.
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Volume:
1156
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-1156-D04-10
Date:
January, 2009
File:
PDF, 245 KB
english, 2009
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