Hybrid Modelling Approach for Investigating the Thermal Contact during Solid State Joining
Wang, Hua, Colegrove, Paul, dos Santos, Jorge F.Volume:
783-786
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.783-786.2225
Date:
May, 2014
File:
PDF, 381 KB
english, 2014