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Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range
Testu, S., Besson, J.L., Rouxel, Tanquy, Granger, G.B.Volume:
171-174
Year:
2000
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.171-174.817
File:
PDF, 575 KB
english, 2000