Study on the Surface and Subsurface Integrity of Ground...

Study on the Surface and Subsurface Integrity of Ground Monocrystalline Silicon Wafers

Kang, Ren Ke, Zhang, Y.X., Guo, Dong Ming, Jin, Zhu Ji
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Volume:
291-292
Year:
2005
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.291-292.425
File:
PDF, 548 KB
english, 2005
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