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Grain-Size Effect on a Plasma-Based Copper Etch Process
Liu, Guojun, Kuo, Yue, Ahmed, Shafaat, Buckley, Denis N., Tanaka-Ahmed, TanjimVolume:
155
Year:
2008
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2904937
File:
PDF, 700 KB
english, 2008