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Thermal Properties and Fracture Behavior of Compositionally Graded Al-SiCp Composites
Cho, Kyung Mox, Choi, Il Dong, Park, Ik MinVolume:
449-452
Year:
2004
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.449-452.621
File:
PDF, 584 KB
english, 2004