Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding
Guo, X.G., Guo, Dong Ming, Kang, Ren Ke, Jin, Zhu JiVolume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.304-305.286
File:
PDF, 352 KB
english, 2006