Molecular Dynamics Analyze on Effects of Abrasive Size and...

Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding

Guo, X.G., Guo, Dong Ming, Kang, Ren Ke, Jin, Zhu Ji
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Volume:
304-305
Year:
2006
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.304-305.286
File:
PDF, 352 KB
english, 2006
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