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Impact of Pad–Wafer Contact Area in Chemical Mechanical Polishing
Yeruva, Suresh B., Park, Chang-Won, Rabinovich, Yakov I., Moudgil, Brij M.Volume:
156
Year:
2009
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3186032
File:
PDF, 348 KB
english, 2009