Improved electrical and thermal properties of Ag contacts...

Superlattices and Microstructures 2009 Vol. 46; Iss. 4

Improved electrical and thermal properties of Ag contacts for GaN-based flip-chip light-emitting diodes by using a NiZn alloy capping layer

Se-Yeon Jung, Yoon-Han Kim, Young Shik Kong, Tae-Yeon Seong
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Volume:
46
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.spmi.2009.04.007
File:
PDF, 1.03 MB
english, 2009
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