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The Stepwise Cross-sectional Crystalline Analysis of the Stress Induced Voiding in Cu Interconnect
Lee, Hyo-Jong, Han, Heung Nam, Kang, Suk Hoon, Sun, Jeong-Yun, Oh, Kyu HwanVolume:
914
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/PROC-0914-F07-04
Date:
January, 2006
File:
PDF, 472 KB
english, 2006