Investigation of fused silica glass etching using C4F8/Ar...

Microsystem Technologies 2016 / 1 Vol. 22; Iss. 1

Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Lin, Laicun, Jing, Xiangmeng, Wang, Qidong, Jiang, Feng, Cao, Liqiang, Yu, Daquan
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Volume:
22
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-015-2449-z
Date:
January, 2016
File:
PDF, 1.27 MB
english, 2016
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