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Aluminum nitride for heatspreading in RF IC’s
L. La Spina, E. Iborra, H. Schellevis, M. Clement, J. Olivares, L.K. NanverVolume:
52
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.sse.2008.04.009
File:
PDF, 649 KB
english, 2008