Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints
Goh, Yingxin, Haseeb, A. S. M. A., Liew, Haw Ling, Sabri, Mohd Faizul MohdVolume:
50
Language:
english
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-015-8978-0
Date:
June, 2015
File:
PDF, 3.43 MB
english, 2015