![](/img/cover-not-exists.png)
Creep behavior of SnAgCu solders containing nano-Al particles
Zhang, Liang, Han, Ji-guang, Guo, Yong-huan, Sun, LeiVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2876-8
Date:
June, 2015
File:
PDF, 1.48 MB
english, 2015