Microstructure and properties of Al/Sip composites for thermal management applications
Cai, Zhiyong, Wang, Richu, Zhang, Chun, Peng, Chaoqun, Wang, LinqianVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2973-8
Date:
June, 2015
File:
PDF, 1.23 MB
english, 2015