Recent progresses on hybrid micro–nano filler systems for...

Journal of Materials Science: Materials in Electronics 2015 / 7 Vol. 26; Iss. 7

Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

Meschi Amoli, Behnam, Hu, Anming, Zhou, Norman Y., Zhao, Boxin
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Volume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3016-1
Date:
July, 2015
File:
PDF, 3.12 MB
english, 2015
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