Interface Reaction Between Electroless Ni–Sn–P...

Journal of Electronic Materials 2014 / 11 Vol. 43; Iss. 11

Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation

Yang, Ying, Balaraju, J. N., Huang, Yizhong, Tay, Yee Yan, Shen, Yiqiang, Tsakadze, Zviad, Chen, Zhong
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3306-z
Date:
November, 2014
File:
PDF, 2.09 MB
english, 2014
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