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Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions
Nguyen, Van Luong, Kim, Ho-KyungVolume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3741-5
Date:
July, 2015
File:
PDF, 1.92 MB
english, 2015