Effect of pad’s surface deformation and oscillation on...

International Journal of Precision Engineering and Manufacturing 2014 / 11 Vol. 15; Iss. 11

Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality

Choi, Woong-Kirl, Kim, Seong-Hyun, Choi, Seung-Geon, Lee, Eun-Sang, Lee, Chul-Hee
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Volume:
15
Language:
english
Journal:
International Journal of Precision Engineering and Manufacturing
DOI:
10.1007/s12541-014-0594-4
Date:
November, 2014
File:
PDF, 1.53 MB
english, 2014
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