High performance heat curing copper-silver powders filled...

Electronic Materials Letters 2015 / 3 Vol. 11; Iss. 2

High performance heat curing copper-silver powders filled electrically conductive adhesives

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
11
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-014-4292-2
Date:
March, 2015
File:
PDF, 2.04 MB
english, 2015
Conversion to is in progress
Conversion to is failed