Joint strength and interfacial microstructure between...

Science and Technology of Advanced Materials 2004 Vol. 5; Iss. 1-2

Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate

Akio Hirose, Hiroto Yanagawa, Eiichi Ide, Kojiro F Kobayashi
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Volume:
5
Year:
2004
Language:
english
Pages:
10
DOI:
10.1016/j.stam.2003.10.024
File:
PDF, 568 KB
english, 2004
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