Effect of Electromagnetic Field on the Solidification...

Effect of Electromagnetic Field on the Solidification Structure of C70250 Copper Alloy

Li, Bao Mian, Zhang, Hai Tao, Cui, Jian Zhong
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Volume:
287-290
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.287-290.2744
Date:
July, 2011
File:
PDF, 514 KB
english, 2011
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