Ionization fraction in sputter-based copper ion sources for...

Surface and Coatings Technology 2005 Vol. 196; Iss. 1-3

Ionization fraction in sputter-based copper ion sources for plasma immersion ion implantation

Keiji Nakamura, Hajime Suzuki
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Volume:
196
Year:
2005
Language:
english
Pages:
4
DOI:
10.1016/j.surfcoat.2004.08.119
File:
PDF, 224 KB
english, 2005
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