Adhesion properties of Cu/Cr films on polyimide substrate...

Surface and Coatings Technology 2005 Vol. 193; Iss. 1-3

Adhesion properties of Cu/Cr films on polyimide substrate treated by dielectric barrier discharge plasma

Soo Hong Kim, Su Hyeun Cho, N.-E. Lee, Hoon Mo Kim, Yun Woo Nam, Young-Ho Kim
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Volume:
193
Year:
2005
Language:
english
Pages:
6
DOI:
10.1016/j.surfcoat.2004.08.130
File:
PDF, 624 KB
english, 2005
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