Electromigration in copper damascene interconnects:...

Surface and Coatings Technology 2005 Vol. 198; Iss. 1-3

Electromigration in copper damascene interconnects: reservoir effects and failure analysis

Wei Shao, A.V. Vairagar, Chih-Hang Tung, Ze-Liang Xie, Ahila Krishnamoorthy, S.G. Mhaisalkar
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Volume:
198
Year:
2005
Language:
english
Pages:
5
DOI:
10.1016/j.surfcoat.2004.10.090
File:
PDF, 390 KB
english, 2005
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