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Optimisation modelling for thermal fatigue reliability of lead‐free interconnects in fine‐pitch flip‐chip packaging
Stoyanov, Stoyan, Bailey, Chris, Desmulliez, MarcVolume:
21
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910910928265
Date:
February, 2009
File:
PDF, 982 KB
english, 2009